Advanced Wirebond Interconnection Technology by Shankara K. Prasad

By Shankara K. Prasad

"Advanced Wirebond Interconnection know-how addresses cord bonding from either production and reliability views. It analyzes and explores a few of the components that one must contemplate: layout, fabrics, processing, apparatus, caliber checking out and reliability engineering, and final yet no longer least, operator education. This e-book is meant to be a finished resource of data and data that allows either a newcomer to the sphere and a veteran who wishes fast details to determine on a procedure challenge. The e-book explains not just the way to do issues reminiscent of designating a bond pad or a lead finger, easy methods to decide on a correct bond cord, the best way to layout a capillary and the way to optimize a bonding technique at the manufacturing unit ground, however the ebook additionally explains why to do it that manner. A CD-ROM is incorporated, which incorporates second and 3D animations of many suggestions which are mentioned during this booklet. The animations with voice-overs support the reader snatch the tips speedier with visible adventure, which results in larger retention.

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No ultrasonic energy is used during bonding. This has certain advantages and is used in special applications such as bonding of GaAs devices. 5 Comparison of the Three Bonding Technologies In the semiconductor industry, the most widely used wire bonding technology is the thermosonic bonding, followed by ultrasonic bonding and thermocompression bonding technologies. 2 gives a comparison of these technologies and their relative merits. 6 Ultra Fine Pitch Wire Bonding In this age of smaller electronic gadgets, the use of high density, high I/O, and high frequency chips is becoming more widespread.

Therefore the electrical conductivity and the electrical resistivity of the wire are crucial properties. Electrical conductivity is defined as the electrical charge flux per unit voltage. 3, for a one volt potential difference, higher the electron (electrical charge) flux, higher is the electrical conductivity of the material. 4, in pure Au metal, electrons flow freely without any scattering. This indicates that the electrical conductivity is high. But when Au is alloyed with dopants like Be, the electron flux is reduced due to scattering of electrons.

For example, during bonding the capillary deforms the wire to form the bond and pulls the wire along a trajectory to form the loop. During the molding operation a high temperature, extremely viscous molten molding compound pushes the wire which must with stand the viscous force. During the device operation, the wire is subjected to extremes of thermal and power cycling and this demands excellent fatigue resistance of the wire. For fine pitch packaging applications, low wire loops that do not sag and long wire spans that do not sway are required for tight and compact packages.

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